XYZTEC

Standard bond tests on leadframe with in-line loader, unloader and indexer
videos

XYZTEC DETAILS

XYZTEC, incorporated in 2000, designs and manufactures innovative bond test equipment for quality assurance in multiple industries. XYZTEC sets the standard in Statistical Process Control (SPC) with 100% focus on science of bond testing and has established their name as the technology leader in bond testing worldwide.
A number of models are available in the product series. Each is designed for different test needs specifically for the automation level, force range and travel range.

Contact us for more information.

Test Range = X: 168mm, Y: 168mm, Z: 168mm
Max test speed = 5mm/s
Typical Use = Economic solution for standard electronic assembly related bond tests


Download PDF brochure
     

Test Range = X: 370mm, Y: 168mm, Z: 168mm
Max test speed = 50mm/s
Typical Use = Standard bond tests with full test automation


Download PDF brochure
     

Test Range = X: 500mm, Y: 370mm, Z: 90mm
Max test speed = 50mm/s
Typical Use = Bond tests for wafer up to 12” with full test automation and automatic optical grading


Download PDF brochure
     

Test Range = X: 600mm, Y: 168mm, Z: 168mm
Max test speed = 5mm/s
Typical Use = Standard bond tests on leadframe with in-line loader, unloader and indexer


Download PDF brochure
  

Test Range = X: 500mm, Y: 500mm, Z: 200mm
Max test speed = 500mm/s
Typical Use = Bond Tests for bigger test substrate or tests that require higher force (1,000kgf).


Download PDF brochure
  

Test Range = X: 500mm, Y: 800mm, Z: 200mm
Max test speed = 500mm/s
Typical Use = Bond Tests for bigger test substrate or tests that require higher force (1,000kgf)


Download PDF brochure
  

Key Advantages

  • Revolving Measurement Unit (RMU) with maximum 6 sensors at one time for force range up to 200kgf (2,000N). Switching sensor is effortless and instantaneous. Single Measurement Unit is also available with maximum force up to 1,000kgf (10,000N)
  • Statistical Process Control (SPC) tool is built-in on all machines with no additional charge. Many data export formats are available.
  • Highest level of automation with down-looking camera and Pattern Recognition System (PRS) for hands-free bond testing

There are many other strengths including in-line solution, SECS/GEMS data communication with remote server,high wire hook concentricity. Contact us for more information.

Test Types

ENQUIRY